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SENSBEY GEMINI WAVE SOLDERING SYSTEMS

READY for LEAD-FREE and SELECTIVE PALLET SOLDERING

LEAD-FREE READY SOLUTIONS

PREHEATING ISSUES     

  • Profile Stability.

Lead-free evaluations require reduction in temperature variations to insure survivability of components at new (higher) temperature profiles.  Wide preheater variations compound defect generation by overheating components during heat-up and excessive cool down (create plugs where solder wicking must occur). 

 Sensbey’s  preheater technology answers major lead-free challenges:

  •       Heater chassis enclosure design insulation provides reflow quality profile stability to +/- 3 degree C .

  •       Combination convection & radiant heaters in same tray unifies heat-flow across board, at higher temperatures.

  •       The extension preheater between PH and wave eliminates profile droop.

  •         Flux material changes require quick preheat technology changes.    Choose any combination via: Flip of ON/OFF switch, dial of independent temperature settings and no hardware swapping.

 SOLDER RESERVOIR ISSUES   

  • Material compatibility.

Solder reservoir material is compatible with all formulations of lead-free chemistry optimized for wave soldering:  High-grade stainless steel construction, chromium nitride surface hardening  and/or ceramic coated components.

  •  Higher operating temperature. 

Due to higher melting points, lead free alloys operate at elevated temperatures for fluid solder waves. The Gemini solder reservoirs have the heating power capacity required to provide stable temperatures.

  •  Inerting (Optional).

Dross generation is major issue as lead free formulas have higher material cost. Also, some profiles require inerting to enhance wet-ability. The Gemini series is available with and without inerting to match depending on process qualifications.

 

 

SELECTIVE PALLET SOLDERING SOLUTIONS

 SPRAY FLUXING ISSUES

Penetration. For boards that qualify for selective pallet processing, the wave machine must effectively address flux and solder through-hole penetration. Flux must pass through the pallet wells and penetrate thick boards to facilitate complete solder wicking and fillet generation on topside pads.  Flux cannot simply be deposited on board surface. Rather, the transfer must have qualities enhancing uniform solids dispersion combined with efficient penetration of through holes.

 PREHEATING ISSUES

Combination preheating is capable of thoroughly preparing and maintaining positive ramping temperature profiles up to contact with the waves.  If temperatures drop before touching the wave(s), selective pallets can generate heat sink effect, creating a process out of control.

 SOLDER WAVE ISSUES

High flow chimney design allows easy resetting between selective pallet and pallet-less soldering.

 Sensbey’s No-Lead Ready Gemini systems address the issues above

  • MX-Low pressure Spray flux applicator has highest deposition consistency - at  lowest fluid consumption - with effective through-hole penetration. 

For example a water-soluble  flux with 33% solids content is being sprayed at consumption of 15 – 25 ml/min. Although designed for water washing, after wave, this leaves flux residue at such low level it appears to be no-clean. Highly efficient penetration through selective pallet and .090 inch through-holes provides highly effective top fillets.  

  • Leadfree ready solder reservoirs inverter driven 3-ph AC pump motors provide highly effective wicking and penetration. High-Flow wave dynamics stable temperature and surface presentation removes excess through thick pallet wells.

  • Combination convection preheaters allow selection (or combines) of two strong proven technologies. Extended and enwrapped tunnel enclosure provides positive profiles up to wave contact.